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Titanium Sputter Target High Purity Fine Grain Size 4.52 G/Cm3
Titanium Sputter Target High Purity Fine Grain Size 4.52 G/Cm3 Titanium Sputter Target High Purity Fine Grain Size 4.52 G/Cm3 Titanium Sputter Target High Purity Fine Grain Size 4.52 G/Cm3

Titanium Sputter Target High Purity Fine Grain Size 4.52 G/Cm3

Product Details:
Place of Origin: China
Brand Name: JINXING
Certification: ISO 9001
Model Number: high purity Titanium Sputtering Target
Payment & Shipping Terms:
Minimum Order Quantity: 1kg
Price: 20～200USD/kg
Packaging Details: Plywood case
Delivery Time: 10～25 work days
Payment Terms: L/C, D/A, D/P, T/T, Western Union
Supply Ability: 100000kgs/M
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Detail Information
Shape: Round , Plate, Tube Process: CIP, HIP Pressing
Size: Customized Application: PVD Coating System
Material: High Purity Titanium Sputtering Target Grain Size: Fine Grain Size, Good Density
Purity:: 99.95%, 99.99%, 99.999% Density: 4.52g/cm3
High Light:

Fine Grain Size Titanium Sputter Target

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High Purity Titanium Target

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4.52 g/cm3 Sputter Target

Product Description

High purity Titanium Sputtering Target  99.99%, 99.999%

High purity material, ultra-high purity material, semiconductor high purity material


Materials world provides high-purity materials from 4N to 7N: as the basic materials of semiconductor industry and electronic industry, high-purity materials are widely used in various industrial fields, including field luminescent covers, thermoelectronics, electronics, information, infrared, solar cells, high-performance alloys, etc. Jinxing matech supplies a full range of ultra-high purity materials to meet the needs of domestic and international customers. We not only provide high-purity raw materials, but also can make various high-purity raw materials for customers, such as ultra-high purity metal magnetron sputtering target, solar cell magnetron sputtering target, solar film evaporation coating material, electronic high-purity wire rod, strip, powder...

 

Magnetron sputtering target material forming method: the material forming method is selected according to the product performance and different requirements of customers. In general, when the melting point of materials is low, it is necessary to use vacuum melting, casting, forging and rolling to eliminate porosity. Of course, effective heat treatment is necessary to refine the uniform grain material. Materials with high melting point (or materials with high brittleness) are formed by hot pressing or hot isostatic pressing, and some are formed by cold isostatic pressing and then sintered. All kinds of sputtering target materials provided by our company have proper technology, high density, uniform grain and long service life...

 

High purity Titanium Sputtering Target 99.99% , High purity Titanium Sputtering Target 99.999%

are available in varying sizes 

D100x40mm , D101.6x6.35mm etc

 

Product Name Element Purirty Melting Point ℃ Density (g/cc) Available Shapes
High Pure Sliver Ag 4N-5N 961 10.49 Wire, Sheet, Particle, Target
High Pure Aluminum Al 4N-6N 660 2.7 Wire, Sheet, Particle, Target
High Pure Gold Au 4N-5N 1062 19.32 Wire, Sheet, Particle, Target
High Pure Bismuth Bi 5N-6N 271.4 9.79 Particle, Target
High Pure Cadmium Cd 5N-7N 321.1 8.65 Particle, Target
High Pure Cobalt Co 4N 1495 8.9 Particle, Target
High Pure Chromium Cr 3N-4N 1890 7.2 Particle, Target
High Pure Copper Cu 3N-6N 1083 8.92 Wire, Sheet, Particle, Target
High Pure Ferro Fe 3N-4N 1535 7.86 Particle, Target
High Pure Germanium Ge 5N-6N 937 5.35 Particle, Target
High Pure Indium In 5N-6N 157 7.3 Particle, Target
High Pure Magnesium Mg 4N 651 1.74 Wire, Particle, Target
High Pure Magnesium Mn 3N 1244 7.2 Wire, Particle, Target
High Pure Molybdenum Mo 4N 2617 10.22 Wire, Sheet, Particle, Target
High Pure Niobium Nb 4N 2468 8.55 Wire, Target
High Pure Nickel Ni 3N-5N 1453 8.9 Wire, Sheet, Particle, Target
High Pure Lead Pb 4N-6N 328 11.34 Particle, Target
High Pure Palladium Pd 3N-4N 1555 12.02 Wire, Sheet, Particle, Target
High Pure Platinum Pt 3N-4N 1774 21.5 Wire, Sheet, Particle, Target
High Pure Silicon Si 5N-7N 1410 2.42 Particle, Target
High Pure Tin Sn 5N-6N 232 7.75 Wire, Particle, Target
High Pure Tantalum Ta 4N 2996 16.6 Wire, Sheet, Particle, Target
High Pure Tellurium Te 4N-6N 425 6.25 Particle, Target
High Pure Titanium Ti 4N-5N 1675 4.5 Wire, Particle, Target
High Pure Tungsten W 3N5-4N 3410 19.3 Wire, Sheet, Particle, Target
High Pure Zinc Zn 4N-6N 419 7.14 Wire, Sheet, Particle, Target
High Pure Zirconium Zr 4N 1477 6.4 Wire, Sheet, Particle, Target

 

 

Titanium Sputter Target High Purity Fine Grain Size 4.52 G/Cm3 0

Tag:

tungsten sputtering target

metal sputtering targets

titanium sputter target

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