W-Ni-Cu Tungsten Nickel Copper Alloy High Thermal Conductivity

Product Details:
Place of Origin: China
Brand Name: JX
Certification: ISO
Model Number: Tungsten Nickel Copper Alloy W-Ni-Cu
Payment & Shipping Terms:
Minimum Order Quantity: 10kgs
Price: according to actual products
Packaging Details: standard packing
Delivery Time: 25days
Payment Terms: T/T
Supply Ability: 300kgs month

Detail Information

Size: As Request Quality: ISO9001:2008
Surface: Polishing,burnishing,black Surface Delivery Time: 25days
Packing: Standard Exporting Name: Tungsten Nickel Copper Alloy W-Ni-Cu
High Light:

W-Ni-Cu Tungsten Nickel Copper Alloy

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Thermal Conductivity Tungsten Nickel Copper Alloy

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W-Ni-Cu tungsten nickel copper

Product Description

Tungsten Nickel Copper Alloy W-Ni-Cu

Tungsten Nickel Copper Introduction
Tungsten Nickel Copper material is a composite of tungsten and copper, with both tungsten low expansion characteristics, but also has copper of high thermal conductivity properties, and the tungsten and copper in the thermal expansion coefficient and thermal conductivity can be adjusted with the W-Cu composition, also the composite can be machined to various shape, these features make the application of this composite with great convenience. The thermal expansion can be adjusted to match with the following material:

 

Our Tungsten Nickel Copper Features:
No Fe, Co, Ni, Mn and other elements added as the sintering activator, to maintain a high thermal conductivity

Excellent hermeticity
Can provide semi-finished or finished (Ni/Au plated) products
Precision machining and excellent dimensional control, surface finish and flatness
With close technical support including product design, custom manufacturing, testing and post sale supports.
Product PropertiesPhysical Properties of Major Products

Tungsten Nickel Copper  Picture:
W-Ni-Cu Tungsten Nickel Copper Alloy High Thermal Conductivity 0W-Ni-Cu Tungsten Nickel Copper Alloy High Thermal Conductivity 1W-Ni-Cu Tungsten Nickel Copper Alloy High Thermal Conductivity 2

 

Material Wt%
Tungsten Content
Wt%
Copper Content
g/
Density at 20ºC
W/M.K
Thermal conductivity at 25ºC
(10-6/k)
Coefficient of thermal expansion at 20ºC
W90Cu10 901 Balance 17.0 180-190 6.5
W85Cu15 851 Balance 16.4 190-200 7.0
W80Cu20 801 Balance 15.6 200-210 8.3
W75Cu25 751 Balance 14.9 220-230 9.0
W50Cu50 501 Balance 12.2 310-340 12.5
 

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