Mo MoCu Molybdenum Products Wafer Substrate For Semiconductor Industry

Product Details:
Place of Origin: China
Brand Name: JINXING
Certification: ISO 9001
Model Number: Molybdenum Wafer
Payment & Shipping Terms:
Minimum Order Quantity: 1kg
Price: 30~150USD/kg
Packaging Details: Plywood Case
Delivery Time: 25 work days
Payment Terms: L/C, D/A, D/P, T/T, Western Union
Supply Ability: 1000kgs/M

Detail Information

Material: Pure Molybdenum And Molybdenum Copper Standard: ASTM B387
Min THK: 0.05mm Surface: Mirror Bright
Melting Point: 2623 °C Boiling Point: 4639 °C
Size: Customized Technique: Hot Rolling, Cold Rolling
High Light:

molybdenum copper alloy

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molybdenum wire mesh

Product Description

Molybdenum Wafer Substrate for semiconductor and LED chips Mo, MoCu 25.4mm 1inch

Wafer substrate made of molybdenum, molybdenum copper and tungsten copper materials: In order to make the LED lamp durable, it must be equipped with reliable and robust components. With our molybdenum, MoCu and WCu wafer substrates, LED chips can easily reach 100,000 hours of service life.

  • Description

Wafer substrate made of molybdenum, molybdenum copper and tungsten copper materials:

In order to make the LED lamp durable, it must be equipped with reliable and robust components. With our molybdenum, MoCu and WCu wafer substrates, LED chips can easily reach 100,000 hours of service life.

The semiconductor layer in the LED chip converts current into light. The semiconductor layer is composed of an electron region (N-type doping) and a hole region (P-type doping). Current flows through the semiconductor layer, and electrons combine with holes to emit light in the form of photons. The remaining energy is released as heat radiation at temperatures up to 85 °C.

 

 

Material Pure Molybdenum , MoCU alloy
Size Thickness 0.05mm min / Diameter up to 300mm
Surface Cold Rolled , polished
Roughness Mirror bright
Process Laser Cutting, mold-pressed

 

Future LEDs will have higher brightness and operating temperatures will increase. JINXING uses different materials for different needs to provide customers with thermal solutions. For example, LED vertical structure chips based on sapphire or silicon-based substrates, we supply pure molybdenum substrates; and, as we have developed for the vertical structure of sapphire substrates, molybdenum copper and tungsten-copper composites.

 

 

The available molybdenum and molybdenum-copper wafer substrates have a minimum thickness of 0.05 mm and a minimum diameter of 2 in. We can even supply wafer substrates up to 4 inches in diameter or larger. The roughness and flatness of the wafer substrate have a decisive influence on the bonding process with the semiconductor layer. We offer surface treatments for different processes, please contact us.

If you need, our molybdenum, molybdenum-copper and tungsten-copper wafer substrates can be coated. For example, our nickel-gold coatings are resistant to oxidation and prevent corrosion of the substrate. In addition, our nickel-gold layer is the solder or bonding interface of the reflective layer and the heat sink.

 

Mo MoCu Molybdenum Products Wafer Substrate For Semiconductor Industry 0Mo MoCu Molybdenum Products Wafer Substrate For Semiconductor Industry 1 

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