Pure Moly Ion Implanter Parts For Precision Components Industry ASTM B387
|Place of Origin:||China|
|Model Number:||Molybdenum Wafer|
Payment & Shipping Terms:
|Minimum Order Quantity:||1kg|
|Packaging Details:||Plywood Case|
|Delivery Time:||25 work days|
|Payment Terms:||L/C, D/A, D/P, T/T, Western Union|
|Material:||Pure Molybdenum And Molybdenum Copper||Standard:||ASTM B387|
|Min THK:||0.05mm||Surface:||Mirror Bright|
|Melting Point:||2623 °C||Boiling Point:||4639 °C|
|Size:||Customized||Technique:||Hot Rolling, Cold Rolling|
molybdenum copper alloy,
molybdenum wire mesh
Wafer substrate made of molybdenum, molybdenum copper and tungsten copper materials: In order to make the LED lamp durable, it must be equipped with reliable and robust components. With our molybdenum, MoCu and WCu wafer substrates, LED chips can easily reach 100,000 hours of service life.
Wafer substrate made of molybdenum, molybdenum copper and tungsten copper materials:
In order to make the LED lamp durable, it must be equipped with reliable and robust components. With our molybdenum, MoCu and WCu wafer substrates, LED chips can easily reach 100,000 hours of service life.
The semiconductor layer in the LED chip converts current into light. The semiconductor layer is composed of an electron region (N-type doping) and a hole region (P-type doping). Current flows through the semiconductor layer, and electrons combine with holes to emit light in the form of photons. The remaining energy is released as heat radiation at temperatures up to 85 °C.
|Material||Pure Molybdenum , MoCU alloy|
|Size||Thickness 0.05mm min / Diameter up to 300mm|
|Surface||Cold Rolled , polished|
|Process||Laser Cutting, mold-pressed|
Future LEDs will have higher brightness and operating temperatures will increase. JINXING uses different materials for different needs to provide customers with thermal solutions. For example, LED vertical structure chips based on sapphire or silicon-based substrates, we supply pure molybdenum substrates; and, as we have developed for the vertical structure of sapphire substrates, molybdenum copper and tungsten-copper composites.
The available molybdenum and molybdenum-copper wafer substrates have a minimum thickness of 0.05 mm and a minimum diameter of 2 in. We can even supply wafer substrates up to 4 inches in diameter or larger. The roughness and flatness of the wafer substrate have a decisive influence on the bonding process with the semiconductor layer. We offer surface treatments for different processes, please contact us.
If you need, our molybdenum, molybdenum-copper and tungsten-copper wafer substrates can be coated. For example, our nickel-gold coatings are resistant to oxidation and prevent corrosion of the substrate. In addition, our nickel-gold layer is the solder or bonding interface of the reflective layer and the heat sink.