Cuw50-Cuw90 Tungsten Copper Alloy Heat Sinks With Excellent Hermeticity

Product Details:
Place of Origin: China
Brand Name: JINXING
Certification: ISO 9001
Model Number: Tungsten Copper
Payment & Shipping Terms:
Minimum Order Quantity: 1kg
Price: 10~200USD/kg
Packaging Details: Plywood Case
Delivery Time: 25 work days
Payment Terms: L/C, D/A, D/P, T/T, Western Union
Supply Ability: 100000kgs/M

Detail Information

Material: Tungsten Copper Alloy Type: CuW50-CuW90
Purity: W75, W85, W80, W55, W65, W90 Dimensions: Customized
Density: 12.2~17g/cm3 Standard: ASTM B702 RWMA Class 10,Class 11, Class 12
Surface: Polished And Grinding Other Name: Copper Tungsten Heat Sinks
High Light:

Tungsten Copper Alloy Heat Sinks

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Cuw 90 Tungsten Copper Heat Sinks

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Tungsten Heat Sinks With Excellent Hermeticity

Product Description

Tungsten Copper Heat Sinks

Tungsten Copper Heat Sinks are composites of tungsten and copper. By adjusting the content of tungsten, we can have its coefficient of thermal expansion (CTE) designed to match those of materials such as ceramics (Al2O3, BeO), semiconductors (Si), and metals (Kovar), etc. Our products are widely used in applications such as optoelectronics packages, Microwave Packages, C Packages, Laser Submounts,

 

Description:

Product introduction:
- Electronic packaging refers to the outer casing of an integrated circuit chip, passive components, the production of a circuit card and the production of the final product or system enclosure. Packaging is an important protection for environmental factors such as moisture, pollution, hazardous chemicals, radiation signals, power transmission, heat dissipation, and electromagnetic interference shielding.

- Heat dissipation in micropower electronics and circuits is an inevitable by-product. The heat sink helps dissipate heat and transfer it to the surrounding air. The design of the heat sink shape also increases its area of contact with the surrounding cooling air.

- Tungsten copper alloy is one of the most popular refractory metal heat sink materials. It is made by vacuum infiltrating molten copper into a hollow tungsten skeleton. By adjusting the content of tungsten, materials having a coefficient of thermal expansion (CTE) matching their coefficients such as ceramics (alumina, yttria), semiconductors (silicon), and metals (Kovar alloy) are designed.

 

Type Tungsten Wt% Copper Wt% Density g/cm3 Thermal conductivity W/(M.K) Thermal expansivity(10-6/K)
W90Cu10 90 Base 17.0 180 - 190 6.5
W85Cu15 85 Base 16.4 190 - 200 7.0
W80Cu20 80 Base 15.6 200 - 210 8.3
W75Cu25 75 Base 14.9 220 - 230 9.0
W50Cu50 50 Base 12.2 310 - 340 12.5

 

Advantages

  • High thermal conductivity
  • Excellent hermeticity
  • Excellent flatness, surface finish, and size control
  • Semi-finished or finished (Ni/Au plated) products available

 

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