Copper Molybdenum Products Wafer Substrate With High Thermal Conductivity

Product Details:
Place of Origin: China
Brand Name: JINXING
Certification: ISO 9001
Model Number: Molybdenum Copper Wafer substrate
Payment & Shipping Terms:
Minimum Order Quantity: 1kg
Price: 30~150USD/kg
Packaging Details: Plywood Case
Delivery Time: 25 work days
Payment Terms: L/C, D/A, D/P, T/T, Western Union
Supply Ability: 1000kgs/M

Detail Information

Material: Molybdenum Copper Alloy Standard: ASTM, AMS
Surface: Mirror Bright Size: Customized
Min THK: 0.05mm Type: MoCu15~MoCu50
High Light:

molybdenum copper alloy

,

molybdenum wire mesh

Product Description

Molybdenum Copper Wafer substrate for LED chips Diameter 25.4mm / 1.0 inch

Wafer substrate made of molybdenum, molybdenum copper and tungsten copper materials: In order to make the LED lamp durable, it must be equipped with reliable and robust components. With our molybdenum, MoCu and WCu wafer substrates, LED chips can easily reach 100,000 hours of service life.

 

Description

 

Nickel-plated gold-plated molybdenum-copper substrate microelectronic electronic sealing sheet

Copper-molybdenum-copper alloy heat sink material is a composite material of tungsten and copper. It has both low expansion characteristics of tungsten and high thermal conductivity of copper. Especially valuable, its thermal expansion coefficient and thermal conductivity can be adjusted by adjusting the material. The composition of the composition (in terms of terms, its performance is tailorable), thus bringing great convenience to the application of the material. The copper-molybdenum-copper alloy heat sink material produced by our company can form a good thermal expansion match with the following materials:

 

Ceramic materials Al2O3 (A-90, A-95, A-99), BeO (B-95, B-99), AlN, etc.
Semiconductor materials Si, GaAs, SiGe, SiC, InGaP, InGaAs, InAlGaAs, AlGaInP, and AlGaAs
Metal materials Kovar alloy (4J29), 42 alloy, etc

 

The characteristics and performance of our company's copper-molybdenum-copper (Cu/Mo/Cu) alloy heat sink material:

Copper-molybdenum-copper (Cu/Mo/Cu) is a sandwich structure consisting of two sub-layers - copper (Cu) - a core layer - molybdenum (Mo), which has an adjustable coefficient of thermal expansion, high thermal conductivity and its high The characteristics of strength.

1. Copper-molybdenum-copper (Cu/Mo/Cu) alloy heat sink material Features:

High thermal conductivity can be maintained without adding sintering and activation elements such as Fe and Co

Can provide semi-finished products or finished products with Ni/Au plating on the surface

 

 

Copper Molybdenum Products Wafer Substrate With High Thermal Conductivity 0Copper Molybdenum Products Wafer Substrate With High Thermal Conductivity 1 

 
 

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