99.95% / 99.99% Nickel Sputtering Target High Density Customized Size 3N5~4N

Product Details:
Place of Origin: China
Brand Name: JINXING
Certification: ISO 9001
Model Number: Nickel Plate Sputtering Target
Payment & Shipping Terms:
Minimum Order Quantity: 1kg
Price: 20~150USD/kg
Packaging Details: Plywood case
Delivery Time: 10~25 work days
Payment Terms: L/C, D/A, D/P, T/T, Western Union
Supply Ability: 100000kgs/M

Detail Information

Material: Nickel Plate Sputtering Target Process: CIP, HIP Pressing, Melting
Size: Customized Application: PVD Coating System
Shape: Granular, Cylinder , Pieces, Sheets Grain Size: Fine Grain Size, Good Density
Purity:: 99.95%, 99.99%, 99.999% Density: 8.9g/cm3
High Light:

titanium sputter target

,

tungsten sputtering target

Product Description

Nickel Plate Sputtering Target high purity 99.95%, 99.99%, 

High purity material, ultra-high purity material, semiconductor high purity material


Materials world provides high-purity materials from 4N to 7N: as the basic materials of semiconductor industry and electronic industry, high-purity materials are widely used in various industrial fields, including field luminescent covers, thermoelectronics, electronics, information, infrared, solar cells, high-performance alloys, etc. Jinxing matech supplies a full range of ultra-high purity materials to meet the needs of domestic and international customers. We not only provide high-purity raw materials, but also can make various high-purity raw materials for customers, such as ultra-high purity metal magnetron sputtering target, solar cell magnetron sputtering target, solar film evaporation coating material, electronic high-purity wire rod, strip, powder...

 


Magnetron sputtering target material forming method: the material forming method is selected according to the product performance and different requirements of customers. In general, when the melting point of materials is low, it is necessary to use vacuum melting, casting, forging and rolling to eliminate porosity. Of course, effective heat treatment is necessary to refine the uniform grain material. Materials with high melting point (or materials with high brittleness) are formed by hot pressing or hot isostatic pressing, and some are formed by cold isostatic pressing and then sintered. All kinds of sputtering target materials provided by our company have proper technology, high density, uniform grain and long service life...

 

Nickel Plate Sputtering Target 99.99% , Nickel Planar Sputtering Target 99.999%

are available in varying sizes

 

 
Grades: Nickel Sputtering target
  Purity: 99.95%, 99.99%
Nickel High purity Nickel Sputtreing target
Density: 8.9g/cm3
Shape: Round Shape , Tube Shape and Plate Shape.

 

Sizes:

 

Plate sputtering targets:

 

Thickness: 0.04 to 1.40" (1.0 to 35mm).

Width up to 20"(50 to 500mm).

Length: 3.9" to 6.56 feet( 100-2000mm)

other sizes as requested.

 

Cylinder sputtering targets:

 

3.94 Dia. x 1.58"(100 Dia. x 40mm)

2.56 Dia. x 1.58" (65 Dia. x 40mm)

or 63*32mm other sizes as requested.

 

Tube sputtering targets:

 

2.76 OD x 0.28 WT x 39.4”L (70 OD x 7 WT x 1000mm L)

3.46 OD x 0.39 WT x 48.4”L (88 OD x 10 WT x 1230mm L)

other sizes as requested.

 

Application field of sputtering coating: Sputtering coating is widely used in packaging coating, decoration coating, architectural glass coating, automobile glass coating, low radiation glass coating, flat panel display, optical communication / optical industry, optical data storage industry, optical data storage industry, magnetic data storage industry, optical coating, semiconductor field, automation, solar energy, medical treatment, self lubrication film, capacitor Device coating, other functional coating, etc. (click to enter the detailed introduction)

 

 

Type Application Main alloy Request
Semiconductor Preparation of core materials for integrated circuits W. Tungsten titanium (WTI), Ti, Ta, Al alloy, Cu, etc., with a purity of more than 4N or 5N

 

 

 

Highest technical requirements, ultra-high purity metal, high precision size, high integration

 

Screen Display Sputtering technology ensures uniformity of film production, improves productivity and reduces cost Niobium target, Silicon target, Cr target, molybdenum target, MoNb, Al target, Aluminum alloy target, Copper target, Copper alloy target

 

 

 

High technical requirements, high-purity materials, large material area and high degree of uniformity

 

Decorate It is used for coating on the surface of products to beautify the effect of wear resistance and corrosion resistance

 

 

 

 

Chromium target, titanium target, zirconium (Zr), nickel, tungsten, titanium aluminum, CRSI, CrTi, cralzr, stainless steel target

 

mainly used for decoration, energy saving, etc
Tooling

 

 

 

Strengthen the surface of tools and moulds, improve the service life and the quality of manufactured parts

 

TiAl target, Cr Al target, Cr target, Ti target, tin, tic, Al203, etc High performance requirements and long service life
Solar photovoltaic Sputtered thin film technology for the fabrication of the fourth generation thin film solar cells Zinc aluminum oxide target, zinc oxide target, zinc aluminum target, molybdenum target, cadmium sulfide (CDS) target, copper indium gallium selenium, etc Wide Application
Electronic accessories

 

 

 

 

For film resistance and film capacitance

 

NiCr target, NiCr target, Cr Si target, Ta target, NiCr Al target, etc Small size, good stability and small resistance temperature coefficient are required for electronic devices
Information storage

 

 

 

 

For making magnetic memory

 

Cr based, Co based, CO Fe based, Ni based alloys High storage density, high transmission speed

99.95% / 99.99% Nickel Sputtering Target High Density Customized Size 3N5~4N 0

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