Forged Zirconium Sputtering Target Zr702 Sputter Target
|Place of Origin:||China|
|Model Number:||Nickel Plate Sputtering Target|
Payment & Shipping Terms:
|Minimum Order Quantity:||1kg|
|Packaging Details:||Plywood case|
|Delivery Time:||10～25 work days|
|Payment Terms:||L/C, D/A, D/P, T/T, Western Union|
|Material:||Nickel Plate Sputtering Target||Process:||CIP, HIP Pressing, Melting|
|Size:||Customized||Application:||PVD Coating System|
|Shape:||Granular, Cylinder , Pieces, Sheets||Grain Size:||Fine Grain Size, Good Density|
|Purity::||99.95%, 99.99%, 99.999%||Density:||8.9g/cm3|
titanium sputter target,
tungsten sputtering target
Materials world provides high-purity materials from 4N to 7N: as the basic materials of semiconductor industry and electronic industry, high-purity materials are widely used in various industrial fields, including field luminescent covers, thermoelectronics, electronics, information, infrared, solar cells, high-performance alloys, etc. Jinxing matech supplies a full range of ultra-high purity materials to meet the needs of domestic and international customers. We not only provide high-purity raw materials, but also can make various high-purity raw materials for customers, such as ultra-high purity metal magnetron sputtering target, solar cell magnetron sputtering target, solar film evaporation coating material, electronic high-purity wire rod, strip, powder...
Magnetron sputtering target material forming method: the material forming method is selected according to the product performance and different requirements of customers. In general, when the melting point of materials is low, it is necessary to use vacuum melting, casting, forging and rolling to eliminate porosity. Of course, effective heat treatment is necessary to refine the uniform grain material. Materials with high melting point (or materials with high brittleness) are formed by hot pressing or hot isostatic pressing, and some are formed by cold isostatic pressing and then sintered. All kinds of sputtering target materials provided by our company have proper technology, high density, uniform grain and long service life...
Nickel Plate Sputtering Target 99.99% , Nickel Planar Sputtering Target 99.999%
are available in varying sizes
|Grades:||Nickel Sputtering target|
|Purity: 99.95%, 99.99%|
|Nickel||High purity Nickel Sputtreing target|
|Shape:||Round Shape , Tube Shape and Plate Shape.|
Plate sputtering targets:
Thickness: 0.04 to 1.40" (1.0 to 35mm).
Width up to 20"(50 to 500mm).
Length: 3.9" to 6.56 feet( 100-2000mm)
other sizes as requested.
Cylinder sputtering targets:
3.94 Dia. x 1.58"(100 Dia. x 40mm)
2.56 Dia. x 1.58" (65 Dia. x 40mm)
or 63*32mm other sizes as requested.
Tube sputtering targets:
2.76 OD x 0.28 WT x 39.4”L (70 OD x 7 WT x 1000mm L)
3.46 OD x 0.39 WT x 48.4”L (88 OD x 10 WT x 1230mm L)
other sizes as requested.
Application field of sputtering coating: Sputtering coating is widely used in packaging coating, decoration coating, architectural glass coating, automobile glass coating, low radiation glass coating, flat panel display, optical communication / optical industry, optical data storage industry, optical data storage industry, magnetic data storage industry, optical coating, semiconductor field, automation, solar energy, medical treatment, self lubrication film, capacitor Device coating, other functional coating, etc. (click to enter the detailed introduction)
|Semiconductor||Preparation of core materials for integrated circuits||W. Tungsten titanium (WTI), Ti, Ta, Al alloy, Cu, etc., with a purity of more than 4N or 5N||
Highest technical requirements, ultra-high purity metal, high precision size, high integration
|Screen Display||Sputtering technology ensures uniformity of film production, improves productivity and reduces cost||Niobium target, Silicon target, Cr target, molybdenum target, MoNb, Al target, Aluminum alloy target, Copper target, Copper alloy target||
High technical requirements, high-purity materials, large material area and high degree of uniformity
|Decorate||It is used for coating on the surface of products to beautify the effect of wear resistance and corrosion resistance||
Chromium target, titanium target, zirconium (Zr), nickel, tungsten, titanium aluminum, CRSI, CrTi, cralzr, stainless steel target
|mainly used for decoration, energy saving, etc|
Strengthen the surface of tools and moulds, improve the service life and the quality of manufactured parts
|TiAl target, Cr Al target, Cr target, Ti target, tin, tic, Al203, etc||High performance requirements and long service life|
|Solar photovoltaic||Sputtered thin film technology for the fabrication of the fourth generation thin film solar cells||Zinc aluminum oxide target, zinc oxide target, zinc aluminum target, molybdenum target, cadmium sulfide (CDS) target, copper indium gallium selenium, etc||Wide Application|
For film resistance and film capacitance
|NiCr target, NiCr target, Cr Si target, Ta target, NiCr Al target, etc||Small size, good stability and small resistance temperature coefficient are required for electronic devices|
For making magnetic memory
|Cr based, Co based, CO Fe based, Ni based alloys||High storage density, high transmission speed|