Copper Plate Sputtering Target Ultra High Purity 99.999%, 99.9999%

Product Details:
Place of Origin: China
Brand Name: JINXING
Certification: ISO 9001
Model Number: Copper Plate Sputtering Target
Payment & Shipping Terms:
Minimum Order Quantity: 1kg
Price: 15~100USD/kg
Packaging Details: Plywood case
Delivery Time: 10~25 work days
Payment Terms: L/C, D/A, D/P, T/T, Western Union
Supply Ability: 100000kgs/M

Detail Information

Material: Copper Process: CIP, HIP Pressing
Size: Customized Application: PVD Coating,
Density: 8.96g/cm3 Shape: Round , Plate , Tube Sputtering Target
Grain Size: Fine Grain Size, Good Density Purity: 99.999%, 99.9999%
High Light:

metal sputtering targets

,

tungsten sputtering target

Product Description

Copper Plate Sputtering Target Ultra high purity 99.999%, 99.9999%

6N ultra-high purity electrolytic copper is mainly used in the production of sputtering target, evaporation film and anode materials for integrated circuits.

 

Purity: 99.999% ~ 99.9999%

For precise control of impurity content, Ag content can be controlled below 0.1ppm and s content below 0.02ppm

 

The content of gas elements (C, O, N, H) is less than 1ppm

Main uses: 6N copper has some properties similar to gold, good conductivity, ductility, corrosion resistance and surface performance, and low softening temperature. As a new kind of material, high-purity copper is not only used in the preparation of high-purity analytical standard test materials, various connecting wires for electronic industry, bonding wires for electronic packaging, high-quality audio wires and integrated circuits, sputtering targets for liquid crystal display and ion coating, but also an indispensable and precious material in the atomic energy, rocket, missile, aviation, aerospace and metallurgical industries . As a new material, ultra pure copper has been paid more and more attention. In addition to the preparation of high-purity analytical standard test materials, various connecting wires for electronic industry, bonding wires for electronic packaging, high-quality audio wires and integrated circuits, sputtering targets and ion coating for liquid crystal display, high-quality audio circuits and other high-tech fields, high-purity copper is also used in atomic energy, rockets, missiles, aviation, space navigation and other fields Precious materials are indispensable in metallurgical industry. With the development of high and new technology and the need of strategic materials, high-purity metals have higher and higher requirements for purity. The preparation and application of high-purity and ultra-high-purity metals in modern materials science and engineering are new and growing fields.

 

Copper Sputtering Target 99.9999% , Copper Sputtering Target 99.9999% are available in varying sizes

Sizes:

 

Plate sputtering targets:

 

Thickness: 0.04 to 1.40" (1.0 to 35mm).

Width up to 20"(50 to 500mm).

Length: 3.9" to 6.56 feet( 100-2000mm)

other sizes as requested.

 

Cylinder sputtering targets:

 

3.94 Dia. x 1.58"(100 Dia. x 40mm)

2.56 Dia. x 1.58" (65 Dia. x 40mm)

or 63*32mm other sizes as requested.

 

Tube sputtering targets:

 

2.76 OD x 0.28 WT x 39.4”L (70 OD x 7 WT x 1000mm L)

3.46 OD x 0.39 WT x 48.4”L (88 OD x 10 WT x 1230mm L)

other sizes as requested.

 

Advantage: 

 

1. Purity: 99.99% ~ 99.9999%

2. High density, no defects inside, even grains and smooth surface

3. Unique melting and casting pollution control process

4. It can meet the needs of customized alloy

5. Unique homogenization control technology of added elements

6. Unified microstructure control

 

 

 
Product Name Element Purirty Melting Point Density (g/cc) Available Shapes
High Pure Sliver Ag 4N-5N 961 10.49 Wire, Sheet, Particle, Target
High Pure Aluminum Al 4N-6N 660 2.7 Wire, Sheet, Particle, Target
High Pure Gold Au 4N-5N 1062 19.32 Wire, Sheet, Particle, Target
High Pure Bismuth Bi 5N-6N 271.4 9.79 Particle, Target
High Pure Cadmium Cd 5N-7N 321.1 8.65 Particle, Target
High Pure Cobalt Co 4N 1495 8.9 Particle, Target
High Pure Chromium Cr 3N-4N 1890 7.2 Particle, Target
High Pure Copper Cu 3N-6N 1083 8.92 Wire, Sheet, Particle, Target
High Pure Ferro Fe 3N-4N 1535 7.86 Particle, Target
High Pure Germanium Ge 5N-6N 937 5.35 Particle, Target
High Pure Indium In 5N-6N 157 7.3 Particle, Target
High Pure Magnesium Mg 4N 651 1.74 Wire, Particle, Target
High Pure Magnesium Mn 3N 1244 7.2 Wire, Particle, Target
High Pure Molybdenum Mo 4N 2617 10.22 Wire, Sheet, Particle, Target
High Pure Niobium Nb 4N 2468 8.55 Wire, Target
High Pure Nickel Ni 3N-5N 1453 8.9 Wire, Sheet, Particle, Target
High Pure Lead Pb 4N-6N 328 11.34 Particle, Target
High Pure Palladium Pd 3N-4N 1555 12.02 Wire, Sheet, Particle, Target
High Pure Platinum Pt 3N-4N 1774 21.5 Wire, Sheet, Particle, Target
High Pure Silicon Si 5N-7N 1410 2.42 Particle, Target
High Pure Tin Sn 5N-6N 232 7.75 Wire, Particle, Target
High Pure Tantalum Ta 4N 2996 16.6 Wire, Sheet, Particle, Target
High Pure Tellurium Te 4N-6N 425 6.25 Particle, Target
High Pure Titanium Ti 4N-5N 1675 4.5 Wire, Particle, Target
High Pure Tungsten W 3N5-4N 3410 19.3 Wire, Sheet, Particle, Target
High Pure Zinc Zn 4N-6N 419 7.14 Wire, Sheet, Particle, Target
High Pure Zirconium Zr 4N 1477 6.4 Wire, Sheet, Particle, Target

Copper Plate Sputtering Target Ultra High Purity 99.999%, 99.9999% 0

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