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March 24, 2023
Tungsten Alloy Products Premium Tungsten Alloy Bars ,90WNiCu Heavy Tungsten Alloy Cylinder High Density Knowledge About Polishing Process In Machining
1.The difference between Polishing and Grinding
Polishing mainly refers to the use of mechanical, chemical or electrochemical effects to reduce the surface roughness of the workpiece to obtain a bright and smooth surface.
Grinding is the use of abrasive particles coated or pressed on the grinding tool to finish the processing surface through the relative movement of the grinding tool and the workpiece under a certain pressure. It can be used to process various metal and non-metal materials, and the processed surface shapes include plane, inner and outer cylindrical and conical surfaces, convex and concave spherical surfaces, threads, tooth surfaces and other profiles.
The main difference between the two is that the surface finish achieved by polishing is higher than that of grinding, and chemical or electrochemical methods can be used, while grinding basically only uses mechanical methods, and the abrasive grain size used is coarser than that used for polishing. That is, the particle size is large.
2.The latest technological development: Ultra-precision Polishing is the soul of the modern electronics industry
Ultra-precision polishing has almost strict requirements on the material composition and technical requirements of the grinding disc (core device) in the polishing machine. This kind of steel plate made of special materials must not only meet the nano-level precision of automatic operation, but also have an accurate thermal expansion coefficient (the error should be controlled within a few nanometers). When the polishing machine is running at high speed, if thermal expansion causes thermal deformation of the grinding disc, the flatness and parallelism of the substrate cannot be guaranteed.
Tungsten Alloy Products Premium Tungsten Alloy Bars Ultra-precision polishing technology occupies an important position in the modern electronics industry. Taking wafer manufacturing as an example, polishing is the last step of the whole process, the purpose is to improve the tiny defects left by the previous process of wafer processing to obtain the best parallelism. Today's optoelectronic information industry level requires more and more precise parallelism requirements for optoelectronic substrate materials such as sapphire and single crystal silicon, which have reached the nanometer level. This means that the polishing process has also entered the ultra-precision level of nanometers.
The ultra-precision polishing process is also very suitable for modern manufacturing industries such as integrated circuit manufacturing, medical equipment, auto parts, digital accessories, precision molds, and aerospace. This technology needs to planarize multi-layer materials, so that a few millimeters square silicon wafer can form a very large scale integrated circuit composed of tens of thousands to millions of transistors through this "global planarization". For example, the computer invented by humans has changed from tens of tons to hundreds of grams, which cannot be realized without ultra-precision polishing technology.
At present, the top international polishing processes such as the United States and Japan can already meet the precision polishing requirements of 60-inch substrate raw materials (oversized). Faced with such a strict technical blockade, in the field of ultra-precision polishing, my country can only conduct self-research at present.
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