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Low Density Molybdenum Copper Alloy Plate For Electronic Components
Low Density Molybdenum Copper Alloy Plate For Electronic Components Low Density Molybdenum Copper Alloy Plate For Electronic Components Low Density Molybdenum Copper Alloy Plate For Electronic Components Low Density Molybdenum Copper Alloy Plate For Electronic Components

Low Density Molybdenum Copper Alloy Plate For Electronic Components

Product Details:
Place of Origin: China
Brand Name: JINXING
Certification: ISO 9001
Model Number: Molybdenum Copper Alloy
Payment & Shipping Terms:
Minimum Order Quantity: 1kg
Price: 30~150USD/kg
Packaging Details: Plywood Case
Delivery Time: 10~25 work days
Payment Terms: L/C, D/A, D/P, T/T, Western Union
Supply Ability: 10000kgs/M
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Detail Information
Material: Molybdenum Copper Alloy Standard: ASTM, AMS
Size: Customized Type: MoCu15~MoCu50
Surface: Mirror Bright Density: 9.54~10g/cm3
High Light:

Molybdenum Copper Alloy Plate

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Low Density Molybdenum Plate

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Molybdenum Plate For Electronic Components

Product Description

Molybdenum Copper Plate Mo60Cu40 / Mo70Cu30 / Mo80Cu20 heat sink sealing

Molybdenum Copper Plates can be processed with the content (Mo85Cu15 , Mo80Cu20 , Mo70Cu30 , Mo60Cu40 , Mo50Cu50) MoCu 85/15 Molybdenum-Copper Composite Material , MoCu 70/30 Molybdenum-Copper Composite Material , MoCu 65/35 Molybdenum-Copper Composite Material , Molybdenum-Copper Composite AMC 7525

 

Description

 

Molybdenum Copper Plate is used to manufacture military high-power microelectronic devices as heat sink sealing materials and molybdenum-copper alloy sheets for sealing and structural materials of aluminum oxide ceramics. It is also suitable for manufacturing high thermal conductivity expansion sealing heat in civil high-power microelectronic devices. Sedimentary molybdenum copper alloy plate

 

Type Mo Wt% Cu Wt% g/cm3 W/(M.K)
(10-6/K)
Mo85Cu15 85± 1 Balance 10 160 - 180 6.8
Mo80Cu20 801 Balance 9.9 170 - 190 7.7
Mo70Cu30 701 Balance 9.8 180 - 200 9.1
Mo60Cu40 601 Balance 9.66 210 - 250 10.3
Mo50Cu50 50 ±0.2 Balance 9.54 230 - 270 11.5
 
Material Notes: Characteristics:
  • High thermal conductivity
  • Low thermal expansion
  • Low density
Applications:
  • Electronic components - passive cooling elements
  • Automotive industry - carrier plates for IGBT modules in electric drives

Related

  • Molybdenum Copper Wafer substrate

  • Molybdenum Copper Heat sink

  • Molybdenum Copper Rod

Low Density Molybdenum Copper Alloy Plate For Electronic Components 0 

Tag:

molybdenum wire mesh

molybdenum copper alloy

tzm molybdenum alloy

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