High Pure Molybdenum Products Ion Implanting Parts In Semiconductor Application

Product Details:
Place of Origin: CHINA
Brand Name: JINXING
Certification: ISO 9001
Model Number: Moly Ion Implanting Parts
Payment & Shipping Terms:
Minimum Order Quantity: 15 kg
Price: Negotiable
Packaging Details: plywood cases
Delivery Time: 15-20 days
Payment Terms: L/C, T/T, D/P, Western Union
Supply Ability: 2000 kg per month

Detail Information

Product Name: Moly Ion Implanting Parts Grade: Mo1
Density: 10.2 G/cm3 Purity: >=99.95%
Tensile Strength: >325 MPa Elongation: <21%
Standard: ASTM B387-01 Application: Semiconductor Industry
High Light:

Ion Implanting Molybdenum Products

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Molybdenum Ion Implanting Parts

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Semiconductor Ion Implanting Parts

Product Description

High-Pure Moly Ion Implanting Parts In Semiconductor Application

Moly Ion Implanting Parts are an ion beam technology that ionizes the atoms of an element into ions, accelerates them at a voltage of tens to hundreds of kV, and injects them into the surface of workpiece material placed in vacuum target chamber after obtaining high speed.

 

After ion implantation, the physical, chemical and mechanical properties of the surface of the material will change significantly. The continuous wear resistance of the metal surface can reach 2 ~ 3 orders of magnitude of the initial implantation depth.

 

 

SPECIFICATION & CHEMICAL COMPOSITIONS  (NOMINALS)

Material Type Chemical Composition (by wt.)
Pure Moly Mo1 >99.95%min. Mo
Ti-Zr-Mo Alloy TZM 0,5 % Ti / 0,08 % Zr / 0,01 - 0,04 % C
Mo-Hf-C MHC 1,2 % Hf / 0,05 - 0,12 % C
Moly Rhenium MoRe 5,0 % Re
Moly Tungsten MoW20 20,0 % W
Moly Tungsten MoW50 50,0 % W

 

 

 

 

 

 

Advantages of Moly Ion Implanting Parts Technology:


(1) It is a pure pollution-free surface treatment technology;


(2) It does not need thermal activation and high temperature environment, so it will not change the overall dimension and surface finish of the workpiece;


(3) Ion implantation layer is a new surface layer formed by a series of physical and chemical interactions between ion beam and substrate surface, and there is no peeling problem between it and substrate;


(4) There is no need for machining and heat treatment after ion implantation.

 

Moly Ion Implanting Parts Picture:
High Pure Molybdenum Products Ion Implanting Parts In Semiconductor Application 0High Pure Molybdenum Products Ion Implanting Parts In Semiconductor Application 1High Pure Molybdenum Products Ion Implanting Parts In Semiconductor Application 2

APPLICATIONS of Moly Ion Implanting Parts

In semiconductor technology, ion implantation has high-precision dose uniformity and repeatability. It can obtain ideal doping concentration and integration, greatly improve the integration, speed, yield and service life of the circuit, and reduce the cost and power consumption. This is different from chemical vapor deposition.

 

In order to obtain ideal parameters, such as film thickness and density, chemical vapor deposition needs to adjust equipment setting parameters, such as temperature and air flow rate, which is a complex process.

 

In addition to the semiconductor production industry, with the rapid development of industrial control automation, ion implantation technology is also widely used in the improvement of metals, ceramics, glass, composites, polymers, minerals and plant seeds.

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