Mechanical MoCu Molybdenum Copper Alloy Polishing Burnishing

Product Details:
Place of Origin: China
Brand Name: JX
Certification: ISO
Model Number: Molybdenum Copper Alloy Mo-Cu Alloy
Payment & Shipping Terms:
Minimum Order Quantity: 10kgs
Price: according to actual products
Packaging Details: standard packing
Delivery Time: 25days
Payment Terms: T/T
Supply Ability: 300kgs month

Detail Information

Size: As Request Quality: ISO9001:2008
Surface: Polishing,burnishing,black Surface Delivery Time: 25days
Packing: Standard Exporting Name: Molybdenum Copper Alloy Mo-Cu Alloy
High Light:

MoCu Molybdenum Copper Alloy

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Burnishing Molybdenum Copper Alloy

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Mechanical Molybdenum Copper Alloy

Product Description

Molybdenum Copper Alloy Mo-Cu Alloy

Molybdenum Copper Alloy Description

Discounted cold rolled 99.95% pure molybdenum strip sheet plates used in Sapphire Crystal GrowthMolybdenum copper alloy (Molybdenum contents 50%-85%)

  1. Molybdenum copper alloy Specification:

    ​Material: Mo50-85Cu15-50
    Density: 9.5g/cm3-10g/cm3
    Product standard: GB8320-87
    MoCu alloy foil size: Thickness(0.08-0.7mm)*Width<120mm*Length<300mm
    MoCu alloy sheet size: diameter(3-100mm)*L<500mm

2. Features of Molybdenum copper alloy:

1) Large sized sheets available ( we can supply as the customers' need)
2) More easily to be stamped into components than CMC
3) Very strong interface bonding which can repeatedly resist 850ºC heat shock
4) Higher thermal conductivity and lower cost
Mo-Cu composites has lower density, its thermal expansion coefficient and thermal conductivity can be adjusted to match many different materials.

Molybdenum Copper Alloy Picture:
Mechanical MoCu Molybdenum Copper Alloy Polishing Burnishing 0Mechanical MoCu Molybdenum Copper Alloy Polishing Burnishing 1Mechanical MoCu Molybdenum Copper Alloy Polishing Burnishing 2
Molybdenum Copper Alloy physical Properties of Major Products

Material Wt%
Molybdenum
Content
Wt%
Copper Content
g/
Density at 20ºC
W/M.K
Thermal conductivity at 25ºC
(/k)
Coefficient of thermal expansion at 20ºC
Mo85Cu15 851 Balance 10 160-180 6.8
Mo80Cu20 801 Balance 9.9 170-190 7.7
Mo70Cu30 701 Balance 9.8 180-200 9.1
Mo60Cu40 601 Balance 9.66 210-250 10.3
Mo50Cu50 500.2 Balance 9.54 230-270 11.5


3. Momolybdenum copper alloy physical properties

Material g/
Density at 20ºC
(10-6/k)
Coefficient of thermal expansion at 20ºC
W/M.K
Thermal conductivity at 25ºC
   
In-plane Thru-thickness In-plane Thru-thickness    
1:4:1 9.4 7.2 9.0 340 300


4. Molybdenum copper alloy application:
molybdenum copper used in spaceflight fields.
Molybdenum copper alloy has more excellent performances, so can be used as high temperature part of rockets and missiles. This alloy has high thermal conductivity, thermal expansion, high melting point, and the good mechanical ability, all of these reasons, which make the molybdenum copper can be used in the spaceflight fields.

 

 

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