
Tungsten W Bucking Bars For Riveting
Product Description
Tungsten W Foil Tape Description
We use pure tungsten materials through high temperature sintering, cutting, repeated rolling, stretching and stamping to obtain high purity and dense microstructure, ensuring the best high temperature performance.
Features
Application
1.Electronic device manufacturing: It can be used to manufacture electronic devices, such as integrated circuit (IC) packaging, insulating substrates, etc.
Tungsten W Foil Tape Specifications:
Grade | W1,W2 |
Technique | Cutting,Pressing,Cold rolled,Hot rolled,Machining,Drawing |
Purity | 99.95%,99.99%,99.999% |
Thickness | 0.07mm |
Length | <1500mm |
Density | 19.1g/cm3 |
Melting Point | 3410℃ |
Thermal expansion coefficient | 4.5×10-6·K-1 |
Surface | Polish,Mirror,Smooth |
Standard | ASTM B760,GB/T3876 |
Certification | ISO 9001 |
Tungsten W Foil Tape Pictures
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