High Quality Zirconium Tube Target with Thread
|Place of Origin:||China|
|Model Number:||Chromium Sputtering Target|
Payment & Shipping Terms:
|Minimum Order Quantity:||1kg|
|Packaging Details:||Plywood case|
|Delivery Time:||10～25 work days|
|Payment Terms:||L/C, D/A, D/P, T/T, Western Union|
|Application:||PVD Coating,||Material:||Chromium, Chrome|
|Process:||CIP, HIP Pressing||Size:||Customized|
|Density:||7.19g/cm3||Shape:||Round , Plate , Tube Sputtering Target|
|Grain Size:||Fine Grain Size, Good Density||Purity:||99.5%, 99.9%, 99.95%|
metal sputtering targets,
titanium sputter target
Chromium sputtering target material is silvery white shiny metal, pure chromium has ductility, and chromium containing impurities is hard and brittle. The density is 7.19g/cm3. Soluble in strong alkali solution. Chromium has a high corrosion resistance, and oxidation is slow in the air, even in the state of red heat. Insoluble in water. Protection by plating on metal
Chromium Sputtering Target, Chromium Target are available in varying sizes
The traditional sintering process of high purity chromium sputtering target prepared by powder metallurgy is analyzed and optimized. The experimental results show that the target density can be effectively guaranteed by processing the sputtering target with "mould pressing + sintering" or "cold isostatic pressing + sintering" and controlling the sintering temperature reasonably.
|Grades:||Chrome Sputtering target|
|Purity: 99.5%, 99.9%, 99.95%|
|Familar Size||D100x40mm , D65x35mm|
|Shape:||Round Shape , Tube Shape and Plate Shape.|
Plate sputtering targets:
Thickness: 0.04 to 1.40" (1.0 to 35mm).
Width up to 20"(50 to 500mm).
Length: 3.9" to 6.56 feet( 100-2000mm)
other sizes as requested.
Cylinder sputtering targets:
3.94 Dia. x 1.58"(100 Dia. x 40mm)
2.56 Dia. x 1.58" (65 Dia. x 40mm)
or 63*32mm other sizes as requested.
Tube sputtering targets:
2.76 OD x 0.28 WT x 39.4”L (70 OD x 7 WT x 1000mm L)
3.46 OD x 0.39 WT x 48.4”L (88 OD x 10 WT x 1230mm L)
other sizes as requested.
Based on the thermodynamic analysis of the vacuum sintering process of pure chromium target for magnetron sputtering, the necessary conditions for the sintering process were established and applied to the sintering practice. The sputtering target with oxygen content less than 0.07% was successfully achieved.
|Semiconductor||Preparation of core materials for integrated circuits||W. Tungsten titanium (WTI), Ti, Ta, Al alloy, Cu, etc., with a purity of more than 4N or 5N||
Highest technical requirements, ultra-high purity metal, high precision size, high integration
|Screen Display||Sputtering technology ensures uniformity of film production, improves productivity and reduces cost||Niobium target, Silicon target, Cr target, molybdenum target, MoNb, Al target, Aluminum alloy target, Copper target, Copper alloy target||
High technical requirements, high-purity materials, large material area and high degree of uniformity
|Decorate||It is used for coating on the surface of products to beautify the effect of wear resistance and corrosion resistance||
Chromium target, titanium target, zirconium (Zr), nickel, tungsten, titanium aluminum, CRSI, CrTi, cralzr, stainless steel target
|mainly used for decoration, energy saving, etc|
Strengthen the surface of tools and moulds, improve the service life and the quality of manufactured parts
|TiAl target, Cr Al target, Cr target, Ti target, tin, tic, Al203, etc||High performance requirements and long service life|
|Solar photovoltaic||Sputtered thin film technology for the fabrication of the fourth generation thin film solar cells||Zinc aluminum oxide target, zinc oxide target, zinc aluminum target, molybdenum target, cadmium sulfide (CDS) target, copper indium gallium selenium, etc||Wide Application|
For film resistance and film capacitance
|NiCr target, NiCr target, Cr Si target, Ta target, NiCr Al target, etc||Small size, good stability and small resistance temperature coefficient are required for electronic devices|
For making magnetic memory
|Cr based, Co based, CO Fe based, Ni based alloys||High storage density, high transmission speed|