ASTMB381/348 Titanium Zirconium Target With Fast Delivering
|Place of Origin:||China|
|Model Number:||Aluminum Silicon Sputtering Target|
Payment & Shipping Terms:
|Minimum Order Quantity:||1kg|
|Packaging Details:||Plywood case|
|Delivery Time:||10～25 work days|
|Payment Terms:||L/C, D/A, D/P, T/T, Western Union|
|Process:||CIP, HIP Pressing||Grain Size:||Fine Grain Size, Good Density|
|Size:||Customized||Application:||PVD Coating System|
|Material:||Aluminum Silicon Alloy (AlSi)||Shape:||Round , Plate, Tube|
Aluminum Silicon Alsi Sputtering Targets,
Alsi Sputtering Targets 90:10,
80:20 Alsi Sputtering Targets
After the development of sputtering coating technology in recent years, the coating technology for various materials has been very perfect. Jinxing company provides a full range of sputtering coating targets (including metal targets, alloy and intermediate alloy targets, ceramic targets) to colleges and universities, scientific research institutions, industrial and mining enterprises.
Application field of sputtering coating: Sputtering coating is widely used in packaging coating, decoration coating, architectural glass coating, automobile glass coating, low radiation glass coating, flat panel display, optical communication / optical industry, optical data storage industry, optical data storage industry, magnetic data storage industry, optical coating, semiconductor field, automation, solar energy, medical treatment, self lubrication film, capacitor Device coating, other functional coating, etc. (click to enter the detailed introduction)
Sputtering target backplane supply, bonding service: the center provides a variety of sputtering target backplane, including oxygen-free copper, molybdenum, aluminum, stainless steel and other materials. At the same time, it provides the welding service between the target and the back plate.
Aluminum Silicon Sputtering Target , Aluminum Silicon Alloy Sputtering Target are available in varying sizes
D100x40mm D65x35mm etc
Magnetron sputtering target material forming method: the material forming method is selected according to the product performance and different requirements of customers. In general, when the melting point of materials is low, it is necessary to use vacuum melting, casting, forging and rolling to eliminate porosity. Of course, effective heat treatment is necessary to refine the uniform grain material. Materials with high melting point (or materials with high brittleness) are formed by hot pressing or hot isostatic pressing, and some are formed by cold isostatic pressing and then sintered. All kinds of sputtering target materials provided by our company have proper technology, high density, uniform grain and long service life...
Applications: optics, electronics, optoelectronics, decoration, solar energy... The coating material supplied by Jinxing company has the advantages of high purity, good density and no flash point
|AlSi Sputtering target||90:10||approx.2.7||660|
AlSi Sputtering target
The main products are :
High purity aluminum Al, high purity copper Cu, high purity titanium Ti, high purity silicon Si, high purity gold Au, high purity silver AG, high purity indium in, high purity magnesium mg, high purity zinc Zn, high purity platinum Pt, high purity germanium Ge, high purity nickel Ni, High purity tantalum TA, gold germanium alloy Auge, gold nickel alloy auni, nickel chromium alloy NiCr, titanium aluminum alloy TiAl, copper indium gallium alloy cuinga, copper indium gallium selenium alloy CuInGaSe, zinc aluminum alloy ZnAl, aluminum silicon alloy AlSi and other metal coating materials.
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