Titanium Silicon Alloy Metal Sputtering Targets With Excellent Oxidation Resistance

Product Details:
Place of Origin: China
Brand Name: JINXING
Certification: ISO 9001
Model Number: Titanium Silicon Sputtering Target
Payment & Shipping Terms:
Minimum Order Quantity: 1kg
Price: 20~150USD/kg
Packaging Details: Plywood case
Delivery Time: 10~25 work days
Payment Terms: L/C, D/A, D/P, T/T, Western Union
Supply Ability: 100000kgs/M

Detail Information

Material: Titanium Silicon Alloy (TiSi) Process: CIP, HIP Pressing
Size: Customized Application: PVD Coating System
Shape: Round , Plate, Tube Grain Size: Fine Grain Size, Good Density
High Light:

Alloy Metal Sputtering Targets

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Titanium Silicon Sputtering Targets

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Sputtering Targets With Oxidation Resistance

Product Description

Titanium Silicon Sputtering Target (TiSi) alloy 85:15/ 80:20 / 75:25 at%

TiSi sputtering target has a wide range of application prospects in machining, electronics, optics and other fields. TiSi target is produced by hot isostatic pressing, smelting and other technologies

 

Silicon alloy is the coating material of nitride hard coating. Silicon ensures excellent oxidation resistance, and titanium ensures high hardness of the coating. The combination of the two has wear resistance even at extremely high temperature. Titanium silicon nitrogen coating has a strong wear resistance, and there is no problem to use coolant in high-speed machining.

 

During the binding process of titanium silicon sputtering target, attention should be paid to the surface metallization. The surface of titanium silicon material is relatively dense, and it needs to be sandblasted and other surface treatment. When binding, it is necessary to adopt sectional heating and furnace cooling to prevent cracking.

 

Application field of sputtering coating: Sputtering coating is widely used in packaging coating, decoration coating, architectural glass coating, automobile glass coating, low radiation glass coating, flat panel display, optical communication / optical industry, optical data storage industry, optical data storage industry, magnetic data storage industry, optical coating, semiconductor field, automation, solar energy, medical treatment, self lubrication film, capacitor Device coating, other functional coating, etc. (click to enter the detailed introduction)


Sputtering target backplane supply, bonding service: the center provides a variety of sputtering target backplane, including oxygen-free copper, molybdenum, aluminum, stainless steel and other materials. At the same time, it provides the welding service between the target and the back plate.

 

Titanium Silicon Sputtering Target ,  Titanium Silicon Alloy Sputtering Target are available in varying sizes 

Other compostion: 85:15at% 80:20at% 75:25at%

 

Vacuum sputtering targets and optical coating materials are widely used in decorative coatings, tool coatings, optical coatings, and coated glass and flat panel display industries. The produced sputtering target has reasonable composition design, smooth and smooth surface, and good electrical conductivity. The working current is stable during sputtering, and the bottom plate of the high-resistance target is firmly applied. , Good stability, good heat resistance, wear resistance and oxidation resistance, small temperature coefficient of resistance and other characteristics.

 

The main products are :

 

High purity aluminum Al, high purity copper Cu, high purity titanium Ti, high purity silicon Si, high purity gold Au, high purity silver AG, high purity indium in, high purity magnesium mg, high purity zinc Zn, high purity platinum Pt, high purity germanium Ge, high purity nickel Ni, High purity tantalum TA, gold germanium alloy Auge, gold nickel alloy auni, nickel chromium alloy NiCr, titanium aluminum alloy TiAl, copper indium gallium alloy cuinga, copper indium gallium selenium alloy CuInGaSe, zinc aluminum alloy ZnAl, aluminum silicon alloy AlSi and other metal coating materials.

 

 
Type Application Main alloy Request
Semiconductor Preparation of core materials for integrated circuits W. Tungsten titanium (WTI), Ti, Ta, Al alloy, Cu, etc., with a purity of more than 4N or 5N

 

 

 

Highest technical requirements, ultra-high purity metal, high precision size, high integration

 

Screen Display Sputtering technology ensures uniformity of film production, improves productivity and reduces cost Niobium target, Silicon target, Cr target, molybdenum target, MoNb, Al target, Aluminum alloy target, Copper target, Copper alloy target

 

 

 

High technical requirements, high-purity materials, large material area and high degree of uniformity

 

Decorate It is used for coating on the surface of products to beautify the effect of wear resistance and corrosion resistance

 

 

 

 

Chromium target, titanium target, zirconium (Zr), nickel, tungsten, titanium aluminum, CRSI, CrTi, cralzr, stainless steel target

 

mainly used for decoration, energy saving, etc
Tooling

 

 

 

Strengthen the surface of tools and moulds, improve the service life and the quality of manufactured parts

 

TiAl target, Cr Al target, Cr target, Ti target, tin, tic, Al203, etc High performance requirements and long service life
Solar photovoltaic Sputtered thin film technology for the fabrication of the fourth generation thin film solar cells Zinc aluminum oxide target, zinc oxide target, zinc aluminum target, molybdenum target, cadmium sulfide (CDS) target, copper indium gallium selenium, etc Wide Application
Electronic accessories

 

 

 

 

For film resistance and film capacitance

 

NiCr target, NiCr target, Cr Si target, Ta target, NiCr Al target, etc Small size, good stability and small resistance temperature coefficient are required for electronic devices
Information storage

 

 

 

 

For making magnetic memory

 

Cr based, Co based, CO Fe based, Ni based alloys High storage density, high transmission speed

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