Al 35% Ti 65% Sputtering Target Titanium Aluminum

Product Description

Sputtering Target Titanium-Aluminum

Aluminum titanium (AlTi) alloy sputtering targets are produced by HIP technology and are widely used in tool coatings and decorative coatings. Compared with the melting process, the TiAl target prepared by the HIP process has a more uniform microscopic internal structure and a smaller grain size, which is suitable for various magnetron sputtering machines and ion coating machines. In the PVD process, the end user can obtain a constant erosion rate and a high purity and uniform thin film coating.

According to research reports on the production process of titanium aluminum alloy targets at home and abroad, the main preparation techniques of Sputtering Target Titanium-Aluminum currently include: high current heating method, hot isostatic pressing sintering method, and hot pressing sintering method.

Our Sputtering Target Titanium-Aluminum are popular due to their:

High ductility

High thermal conductivity

Homogeneous microstructure

Unbeatable level of material purity

Whatever the geometry - rotary or planar arc cathodes or planar sputtering targets: We can supply tailor-made targets that are perfect for your application.

　1. High current heating method

Scholar 1 invented a method for producing titanium-aluminum alloy targets through high-intensity current. This method uses a device that can obtain a large current, and uses high current to heat the titanium powder and aluminum powder, and apply pressure to make the aluminum and titanium react by themselves. A titanium aluminum alloy target is formed. The density of the titanium aluminum alloy target product prepared by this method is >99%, the grain size is ≤100 microns, and the purity is >99%. The composition range of the titanium aluminum alloy target is: titanium content 5% ~75% (atomic ratio), and the rest is aluminum content. This method has low cost and high product density, which can fully meet the requirements of large-scale industrial production. This preparation method requires a device that can obtain large current. The positive and negative electrodes need to have conductivity and pressure transmission functions, and should have good conductivity, toughness and resistance to high temperature softening, etc. Therefore, whether it can have a large current device that meets the process requirements and has stable performance is the key to the preparation method.

2. Hot isostatic pressing sintering method

Scholar 2 invented a powder metallurgy preparation method of titanium aluminum alloy target. This method mixes titanium powder and aluminum powder, and then undergoes powder loading and cold isostatic pressing pre-compression, degassing process, and then heats. Hydrostatic pressing is formed, and finally sintered and processed to obtain a titanium aluminum alloy target. The titanium aluminum alloy target prepared by this method has the characteristics of high density, no porosity, no porosity and segregation, uniform composition, and fine crystal grains. Prepared The density of the titanium aluminum alloy target product is ≥99%, the purity is >99%, the grain size is ≤100 microns, and the maximum specification size can reach 1,000 mm. The composition range of the titanium aluminum alloy target is: titanium content 20% ~ 80 % (Atomic ratio), and the rest is aluminum content. The hot isostatic pressing method is currently the main method for preparing titanium aluminum alloy sputtering targets required by the coating industry. The target products prepared by this method are dense and have a wide range of size specifications However, this method requires the use of a key pressing and sintering equipment, a hot isostatic pressing sintering furnace, which is expensive, which leads to the high cost of the prepared target product, and it is difficult to promote industrialization.

3. Hot pressing sintering method

Scholar 3 et al. invented a rapid hot pressing sintering process for titanium aluminum alloy targets. This process enables titanium aluminum powder to be sintered under the combined action of heat and force. The low melting point of aluminum in the Ti-Al mixture is used to reduce the titanium aluminum alloy. The powders are bonded together to form an alloy sputtering target. The schematic diagram of hot pressing sintering is shown in Figure 2.

Sputtering Target Titanium-Aluminum Picture:

The alloy target prepared by this method has high density (≥95%), small grain size (≤100 microns), and uniform composition. Titanium-aluminum alloy targets with different compositions can be prepared by this process. Titanium-aluminum alloy targets The composition range is: the titanium content is 25% to 75% (atomic ratio), and the rest is aluminum content. The process is short, low cost, and good coating effect, which can meet the requirements of large-scale industrialization.

The characteristic of this process is to transfer pressure through a rigid mold in a vacuum or protective atmosphere, so that the material is sintered and formed under the combined action of heat and force, and the two steps of cold pressing and sintering are combined into one step, which can greatly improve the process efficiency.

This process has high requirements for equipment, and the key equipment is a hot-pressing sintering furnace. The prepared targets are mainly round alloy targets with a diameter of ≤100 mm. In addition, this process is used to prepare titanium-aluminum alloy targets with high aluminum content. At this time, there are problems of difficult demolding and low mold service life. Each target preparation process consumes a set of molds, which increases the production cost of the target. Therefore, it is necessary to choose a suitable mold release agent to improve the yield and mold performance. Utilization rate.

At present, hot press sintering is the most potential preparation technology for titanium aluminum alloy sputtering targets. This technology has high process efficiency and is suitable for industrial production. However, the use of hot press sintering to prepare titanium aluminum alloy sputtering targets is difficult to demold , The problem of low mold service life. Each target preparation process consumes a set of molds, which increases the production cost of the target. In the sintering process of titanium aluminum alloy, titanium belongs to the hard phase with high melting point, and aluminum belongs to the bonding phase. During the sintering process of the high-aluminum titanium-aluminum alloy powder, the low-melting aluminum gradually melts, which can bond the titanium atoms together and finally form an alloy target. However, the wetting angle of the aluminum liquid and the graphite mold is an obtuse angle, and the more aluminum content is Titanium aluminum alloy, the more difficult it is to demold after hot pressing sintering and cooling. Therefore, the hot pressing sintering preparation process of high-aluminum titanium aluminum alloy target needs to choose a suitable release agent to improve the yield and the utilization rate of the mold.

In addition, the sintering temperature, heating rate, and hot pressing pressure in the hot pressing sintering process have a great influence on the final structure and performance of the product. Among them, the sintering temperature is too high, which will lead to the transition from solid phase sintering to liquid phase sintering, making The high melting point hard phase skeleton collapses and wastes power and energy, which is not conducive to reducing costs; in addition, if the sintering temperature is too high, it will cause the growth of crystal grains and the increase and growth of the second phase, which will reduce the sputtering coating performance of the target material. If the target crystal grains are too large, the sputtering surface will be consumed during sputtering, and the unevenness on the surface of the erosion part that appears on the sputtering target will increase, resulting in a decrease in the uniformity of the film thickness of the formed alloy film. When the power is large, the frequency of abnormal discharge of the small arc increases, and the resulting spattering. At the same time, compared with the substrate, the second phase has poor sputtering efficiency and is likely to remain as protrusions, which will also affect the uniformity of the sputtering film. The sintering temperature is too low, which will result in incomplete sintering and low density of the target product. If the heating rate is fast during the hot pressing process, the work efficiency can be improved, but because part of the area is sintered first, the bonding phase will flow, resulting in the target material The final problem of uneven composition. Higher pressure can also improve efficiency, but at the same time it will cause serious mold wear and reduce mold service life.

In summary, hot press sintering is the most potential preparation technology for titanium aluminum alloy sputtering targets. This technology has high process efficiency and is suitable for industrial production. The preparation of titanium aluminum alloy targets by this technology requires repeated trials and selection. The mold release agent can improve the yield rate and the utilization rate of the mold. At the same time, it is necessary to optimize the sintering hot pressing process conditions (sintering temperature, heating rate, hot pressing pressure), improve production efficiency, and reduce costs. With the rapid sputtering coating Growth, and the trend of gradual popularization in China, the market demand for sputtering coating targets is also increasing rapidly every year. Therefore, the research on the preparation technology of titanium aluminum alloy targets has practical significance and great application prospects.