Wcu Plate Tungsten Alloy Heat Sink Sheet Copper Tungsten Part
|Place of Origin:||China|
|Model Number:||W70cu30 Customized Copper Tungsten Rod|
Payment & Shipping Terms:
|Minimum Order Quantity:||10kgs|
|Price:||according to actual products|
|Packaging Details:||standard packing|
|Supply Ability:||300kgs month|
|Surface:||Polishing,burnishing,black Surface||Delivery Time:||25days|
|Packing:||Standard Exporting||Name:||W70cu30 Customized Copper Tungsten Rod|
W70cu30 Tungsten Alloy Products,
W70cu30 Copper Tungsten Rod,
Customized Copper Tungsten Rod
W70cu30 Customized Copper Tungsten Rod
W70cu30 is a two-phase structure pseudo alloy based on tungsten element and copper element as a secondary composition. It is a composite material in metal. Due to the large difference in physical properties of metal copper and tungsten, it cannot be produced by melting and casting. Nowadays, powder alloy technology is generally used for production. Application areas include:
1. High-performance materials for aerospace: Tungsten copper materials have high density, sweat cooling performance, high temperature strength and erosion resistance.
2. Vacuum contact material: The tungsten copper/copper composite contact produced by our company does not contain the third alloy element. The tungsten matrix is sintered at a high temperature above 2000 ℃, and the whole is processed by high vacuum. It has uniform material, low gas and impurity content, The advantages of high conductivity, good composite interface, dense copper layer and so on. For many years, most domestic vacuum load switch tube manufacturers have used our company's composite contacts.
3. Electrodes for EDM: When EDM is used to process cemented carbide products, due to the special performance of WC, the loss of copper or graphite electrodes is quite fast. For EDM of this material, our company's W- Cu electrodes are most suitable.
4. Electronic packaging materials and heat sink materials: W-Cu electronic packaging materials have both the low expansion characteristics of tungsten and the high thermal conductivity of copper. What is particularly valuable is that its thermal expansion coefficient and thermal conductivity can be adjusted by adjusting the material The composition is designed, which brings great convenience to the application of the material. We use high-purity and high-quality raw materials, after pressing, high-temperature sintering and infiltration, we obtain W-Cu electronic packaging materials and heat sink materials with excellent performance. Materials suitable for packaging with high-power devices, such as substrates, electrodes, etc.; high-performance lead frames; thermal control boards and radiators for military and civilian thermal control devices.
Specifications of Copper Tungsten Rod:
|Code No.||Chemical Composition %||Mechanical properties|
|CU||Impurity||W||Density (g/cm3 )||Hardness HB||RES( cm)||Conductivity IACS/ %||TRS/ Mpa|