TUNGSTEN COPPER COMPOSITE (WCu)
Product Brief Introduction Wcu Plate Heat Sink Sheet/Copper Tungsten Part material is a composite of tungsten and copper, with both tungsten low expansion characteristics, but also has copper of high thermal conductivity properties, and the tungsten and copper in the thermal expansion coefficient and thermal conductivity can be adjusted with the W-Cu composition, also the composite can be machined to various shape, these features make the application of this composite with great convenience. The thermal expansion can be adjusted to match with the following material:

 

Material	Wt% Tungsten Content	Wt% Copper Content	g/ Density at 20ºC	W/M.K Thermal conductivity at 25ºC	(10-6/k) Coefficient of thermal expansion at 20ºC
W90Cu10	901	Balance	17.0	180-190	6.5
W85Cu15	851	Balance	16.4	190-200	7.0
W80Cu20	801	Balance	15.6	200-210	8.3
W75Cu25	751	Balance	14.9	220-230	9.0
W50Cu50	501	Balance	12.2	310-340	12.5

 

Wcu Plate Heat Sink Sheet/Copper Tungsten Part picture: