Heat Sink Package Tungsten Copper Alloy Polished Grinding

Product Details:
Place of Origin: China
Brand Name: JINXING
Certification: ISO 9001
Model Number: Copper Tungsten / WCu alloy
Payment & Shipping Terms:
Minimum Order Quantity: 5KGS
Packaging Details: Plywood Case
Delivery Time: 10~25 work days
Payment Terms: L/C, D/A, D/P, T/T, Western Union
Supply Ability: 10000kgs/M

Detail Information

Material: Tungsten Copper Surface: Polished And Grinding
Content: W75, W85, W80, W55, W65, W90 Dimensions: Customized
Density: 12.2~17g/cm3 Application: Resistance Welding , Spot Welding
Type: RWMA Class 10,Class 11, Class 12 Grade: 1W3, 3W3 , 5W3, 10W3 , 30W3 ,3W53,10W53
High Light:

Heat Sink Package Tungsten Copper Alloy


Polished Grinding Tungsten Copper Alloy


Class 11 Tungsten Copper Alloy

Product Description

Tungsten Copper Heat Sink Package Sheet,Tungsten Copper Shim,Tungsten Copper Sheet

Product Introduction:

W-Cu heat sink material is a composite of tungsten and copper, with both tungsten low expansion characteristics, but also has copper of high thermal conductivity properties, and the tungsten and copper in the thermal expansion coefficient and thermal conductivity can be adjusted with the W-Cu composition, also the composite can be machined to various shape, these features make the application of this composite with great convenience

Tungsten Copper Heat Sink Package Sheet Advantages

· High thermal conductivity

· Excellent hermeticity

· Excellent flatness, surface finish, and size control

· Semi-finished or finished (Ni/Au plated) products available

Tungsten Copper Heat Sink Package Sheet are used to conduct heat away from computer chips and integrated circuits, preventing thermal damage. Depending on the electronic device, heat sinks come in different sizes and shapes. Tungsten-copper composites, with copper content (by weight) of 15 to 20 percent, are often used to make heat sinks. Our products are widely used in applications such as optoelectronics packages, Microwave Packages, C Packages, Laser Submounts, etc.

hysical Properties of Major Products

Mark Wt%(W) Wt%(Cu) Density
at 20ºC
Thermal conductivity at 25ºC Coefficient of thermal expansion at 20ºC
W90Cu10 90±1 rest 17.0g/cm3 180-190 6.5
W85Cu15 85±1 rest 16.4g/cm3 190-200 7.0
W80Cu20 80±1 rest 15.6g/cm3 200-210 8.3
W75Cu25 75±1 rest 14.9g/cm3 220-230 9.0
W50Cu50 50±1 rest 12.2g/cm3 310-340 12.5

Tungsten Copper Heat Sink Package Sheet Picture

Heat Sink Package Tungsten Copper Alloy Polished Grinding 0Heat Sink Package Tungsten Copper Alloy Polished Grinding 1


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